Back Side Power Supply for Electronic Devices
A semiconductor device is disclosed, comprising a first semiconductor die comprising a plurality of transistors; a second semiconductor die comprising power supply circuitry configured to generate a supply voltage for the plurality of transistors of the first semiconductor die; and a heat spreader s...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A semiconductor device is disclosed, comprising a first semiconductor die comprising a plurality of transistors; a second semiconductor die comprising power supply circuitry configured to generate a supply voltage for the plurality of transistors of the first semiconductor die; and a heat spreader structure. A power supply routing for a reference voltage or a power supply voltage which extends from the heat spreader structure through the second semiconductor die to the first semiconductor die. |
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