FAN-OUT PACKAGE WITH ANTENNA

FAN-OUT PACKAGE WITH ANTENNA

An electronic device includes a die, a packages structure, and a multilevel redistribution structure having a first via, a first level, a second via, a second level, and passivation material. The first level has a conductive antenna, the first via extends between the conductive antenna and a conduct...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Tang, Yiqi, Murugan, Rajen Manicon
Format: Patent
Sprache:eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRICITY
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Beschreibung
Zusammenfassung:An electronic device includes a die, a packages structure, and a multilevel redistribution structure having a first via, a first level, a second via, a second level, and passivation material. The first level has a conductive antenna, the first via extends between the conductive antenna and a conductive terminal of the die, and the passivation material extends between the first and second levels. The second via extends through the passivation material between the first and second levels. The second level has a conductive reflector.