SEMICONDUCTOR DEVICES HAVING HOLLOW FILLER MATERIALS

SEMICONDUCTOR DEVICES HAVING HOLLOW FILLER MATERIALS

Semiconductor devices having hollow filler materials are disclosed. A disclosed example semiconductor device includes at least one of a substrate or an interposer, interconnects extending through the at least one of the substrate or the interposer, and a composite material integral with or covering...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Xu, Dingying, Pietambaram, Srinivas, Bai, Yiqun, Feng, Hongxia, Kong, Jieying, Lin, Ziyin
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Semiconductor devices having hollow filler materials are disclosed. A disclosed example semiconductor device includes at least one of a substrate or an interposer, interconnects extending through the at least one of the substrate or the interposer, and a composite material integral with or covering at least a portion of the semiconductor device, the composite material including a polymer matrix with a hollow filler material having voids therein.