CORE PATCH WITH MATCHED PTH TO FLI PITCH FOR Z-DISAGGREGATION

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core, where the core comprises an organic material. In an embodiment, a via is provided through a thickness of the core. In an embodiment, a shell is aro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	NIE, Bai, ARANA, Leonel, PIETAMBARAM, Srinivas V, IBRAHIM, Tarek A, SANE, Sandeep B, MARIN, Brandon C
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a core, where the core comprises an organic material. In an embodiment, a via is provided through a thickness of the core. In an embodiment, a shell is around the via, where the shell comprises a magnetic material. In an embodiment, a mold layer is over the core, and a bridge is embedded in the mold layer. In an embodiment, a column is through the mold layer, where the column is aligned with the via.