ELECTRONIC PACKAGE

ELECTRONIC PACKAGE

An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Shih, Chi-Liang, Yang, Sheng-Ming, Chiu, Chih-Hsien, Tsai, Wen-Jung, Liao, Ping-Hung, Yeh, Yu-Wei, Tsai, Tsung-Hsien
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.