SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE

Provided are a semiconductor package substrate, a method of manufacturing the semiconductor package substrate, and a semiconductor package. According to one embodiment of the present disclosure, a semiconductor package substrate includes a base substrate having a lower surface in which a first trenc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KANG, Sung Il, SEO, Seok Kyu, YOON, Dong Jin, BAE, In Seob, PYEON, Dong Young
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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