SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE

Provided are a semiconductor package substrate, a method of manufacturing the semiconductor package substrate, and a semiconductor package. According to one embodiment of the present disclosure, a semiconductor package substrate includes a base substrate having a lower surface in which a first trenc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANG, Sung Il, SEO, Seok Kyu, YOON, Dong Jin, BAE, In Seob, PYEON, Dong Young
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Provided are a semiconductor package substrate, a method of manufacturing the semiconductor package substrate, and a semiconductor package. According to one embodiment of the present disclosure, a semiconductor package substrate includes a base substrate having a lower surface in which a first trench is provided and an upper surface in which a second trench and a third trench are provided, including a circuit pattern and a conductive material; a first resin arranged in the first trench; and a second resin arranged in the second trench and the third trench, wherein the second trench exposes at least a part of the first resin.