WAFER ALIGNMENT IMPROVEMENT THROUGH IMAGE PROJECTION-BASED PATCH-TO-DESIGN ALIGNMENT

WAFER ALIGNMENT IMPROVEMENT THROUGH IMAGE PROJECTION-BASED PATCH-TO-DESIGN ALIGNMENT

Image alignment or image-to-design alignment can be improved using normalized cross-correlation. A setup image to a runtime image are aligned and a normalized cross-correlation scores is determined. Image projections for the images can be determined and aligned in the perpendicular x and y direction...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Brauer, Bjorn
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
PHYSICS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Image alignment or image-to-design alignment can be improved using normalized cross-correlation. A setup image to a runtime image are aligned and a normalized cross-correlation scores is determined. Image projections for the images can be determined and aligned in the perpendicular x and y directions. Alignment of the image projections can include finding projection peak locations and adjusting the projection peak locations in the x and y directions.