LOW-COLOR POLYMERS FOR USE IN ELECTRONIC DEVICES

Disclosed is a polyimide film that exhibits: an in-plane coefficient of thermal expansion (CTE) that is less than 75 ppm/° C. between 50° C. and 250° C.; a glass transition temperature (Tg) that is greater than 250° C. for the polyimide film cured at 260° C. in air; a 1% TGA weight loss temperature...

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Bibliographische Detailangaben
Hauptverfasser: Auman, Brian C, Ngai, Chai Kit, Li, Wei, Radu, Nora Sabina, Summers, John Donald, Atkinson, Wayne, Maeyer, Jonathan Timothy
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Disclosed is a polyimide film that exhibits: an in-plane coefficient of thermal expansion (CTE) that is less than 75 ppm/° C. between 50° C. and 250° C.; a glass transition temperature (Tg) that is greater than 250° C. for the polyimide film cured at 260° C. in air; a 1% TGA weight loss temperature that is greater than 450° C.; a tensile modulus that is between 1.5 GPa and 5.0 GPa; an elongation to break that is greater than 20%; an optical retardation at 550 nm that is less than 100 nm for a 10-μm film; a birefringence at 633 nm that is less than 0.002; a haze that is less than 1.0%; a b* that is less than 3; a yellowness index that is less than 5; and an average transmittance between 380 nm and 780 nm that is greater than 88%.