SEMICONDUCTOR MEMORY DEVICE
A semiconductor memory device according to an embodiment includes a substrate, a lower interconnect, a source line, word lines, a pillar, a pattern portion, a contact. The source line is provided in a first layer above the lower interconnect. The pattern portion is provided to be separated and insul...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A semiconductor memory device according to an embodiment includes a substrate, a lower interconnect, a source line, word lines, a pillar, a pattern portion, a contact. The source line is provided in a first layer above the lower interconnect. The pattern portion is provided to be separated and insulated from the source line in the first layer. A contact is extending in a first direction, penetrating the pattern portion, and provided on the lower interconnect. A width of the contact in a second direction parallel to a surface of the substrate differs between a portion above a boundary plane that is included in the first layer and is parallel to the surface of the substrate, and a portion below the boundary plane. |
---|