METHOD FOR CUTTING A GLASS ELEMENT AND CUTTING SYSTEM
A method for cutting a glass element (2) with a processing laser (4) is intended to enable a particularly simple process sequence with a high degree of reliability and a low level of equipment expenditure. For this purpose, according to the invention, the processing laser (4) is operated in a first...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A method for cutting a glass element (2) with a processing laser (4) is intended to enable a particularly simple process sequence with a high degree of reliability and a low level of equipment expenditure. For this purpose, according to the invention, the processing laser (4) is operated in a first processing step as a perforation laser, with which a perforation (12) is produced in the glass element (2) along an intended cutting line (8), whereby the processing laser (4) is operated in a second processing step with a modified laser beam (14) as a separating laser, with which a splitting of the filaments (6) forming the perforation (12) is effected. |
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