POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE MANUFACTURED USING THE SAME

Disclosed are a polyamide resin composition and a molded article manufactured using the same. The molded article may have excellent mechanical strength, deformation resistance and light resistance, and may be suitable for use without coating. The polyamide resin composition includes a polyamide resi...

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Bibliographische Detailangaben
Hauptverfasser:	Han, In Soo, Yoo, Jung Hyun, An, Boo Youn, Jang, Kyeong Hoon, Myung, Seong Hyun, Ahn, Jin Gi, Jung, Ki Bong, Yu, Seong Jun, Kim, Dae Sik, Yi, Seul
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Disclosed are a polyamide resin composition and a molded article manufactured using the same. The molded article may have excellent mechanical strength, deformation resistance and light resistance, and may be suitable for use without coating. The polyamide resin composition includes a polyamide resin, an auxiliary resin (e.g., an acrylonitrile-butadiene-styrene copolymer), a filler (e.g., glass fibers and glass beads), and a compatibilizer (e.g., copolymer including maleimide).