MULTI-DIE COMMUNICATIONS COUPLINGS USING A SINGLE BRIDGE DIE

MULTI-DIE COMMUNICATIONS COUPLINGS USING A SINGLE BRIDGE DIE

A chip for multi-die communications couplings using a single bridge die, includes: a plurality of dies each including one or more functional circuit blocks; and a first bridge die directly communicatively coupling two or more pairs of dies of the plurality of dies.

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Bibliographische Detailangaben
Hauptverfasser: SWAMINATHAN, RAJA, PANDYA, MIHIR, NAFFZIGER, SAMUEL D, WUU, JOHN, AGARWAL, RAHUL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A chip for multi-die communications couplings using a single bridge die, includes: a plurality of dies each including one or more functional circuit blocks; and a first bridge die directly communicatively coupling two or more pairs of dies of the plurality of dies.