PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BONDING

There is disclosed a packaged semiconductor device comprising: a leadframe having a first thickness; the leadframe comprising a die pad; a semiconductor die thereabove; and epoxy therebetween and arranged to bond the semiconductor die to the die pad; wherein in at least one region under the semiconductor die, the die pad has a second thickness less than the first thickness; wherein the die pad has at least one through-hole in the at least one region; and wherein the epoxy fills the at least one through-hole and extends thereunder and laterally beyond the through-hole. Corresponding leadframes, and an associated method of manufacture are also disclosed.