FLOATING HEAT SINK FOR USE WITH A THERMAL INTERFACE MATERIAL

A technique and corresponding device to provide for a floating heat sink is disclosed. The technique includes a method that allows for insertion of an electronic component (e.g., an optical transceiver) into a cage that has a pre-installed heatsink. At the beginning phases of insertion, no friction is present between the electronic component and the heatsink. At or very near an insertion end phase (the electronic component is almost fully inserted), an actuator (e.g., roller or button) is impacted to impart a pivot motion via a lever arm to cause lowering of the heatsink toward the electronic component. A thermal interface material (TIM) may therefore be present to establish a thermal coupling between the heatsink and the electronic component. The TIM and heatsink contact the electronic component via a downward motion (caused by the pivot) to provide a nearly frictionless sliding impact to the TIM.