STENCIL FOR STENCIL PRINTING PROCESS

A stencil for use in stencil printing is disclosed. The stencil is configured to removably attach or rest on an upper surface of an underlying base. The stencil has an opening through which the conductive paste is deposited by spreading the conductive paste across an upper surface of the stencil and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHENG, Bo, TUFFILE, Charles
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A stencil for use in stencil printing is disclosed. The stencil is configured to removably attach or rest on an upper surface of an underlying base. The stencil has an opening through which the conductive paste is deposited by spreading the conductive paste across an upper surface of the stencil and forcing the paste into the opening and onto an upper surface of the underlying base. The stencil has a stepped edge at a boundary of the opening. The stepped edge includes a ledge or floor that is configured to hold some of the paste even after a squeegee has removed the paste from an upper surface of the stencil. As the stencil is removed from the base, the ledge or floor can carry the paste that it holds away from the base in an effort to reduce an end-of-track bump on the underlying base.