Nanostructure Device and Method of Forming Thereof

A method of forming a semiconductor device includes forming a sacrificial layer over a first stack of nanostructures and an isolation region. A dummy gate structure is formed over the first stack of nanostructures, and a first portion of the sacrificial layer. A second portion of the sacrificial lay...

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Bibliographische Detailangaben
Hauptverfasser: Cheng, Te-En, Lu, Yung-Chen, Lee, Wei-Yang, Chui, Chi On
Format: Patent
Sprache:eng
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Zusammenfassung:A method of forming a semiconductor device includes forming a sacrificial layer over a first stack of nanostructures and an isolation region. A dummy gate structure is formed over the first stack of nanostructures, and a first portion of the sacrificial layer. A second portion of the sacrificial layer is removed to expose a sidewall of the first stack of nanostructures adjacent the dummy gate structure. A spacer layer is formed over the dummy gate structure. A first portion of the spacer layer physically contacts the first stack of nanostructures.