FLATTENING SURFACE OF PASTED TRACK IN STENCIL PRINTING PROCESS

A stencil printing system for printing solder paste on a base substrate to establish an electrical connection is provided. The system includes a stencil configured to removably attach or rest on an upper surface of the base. The stencil has an opening that provides access to the upper surface of the...

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Bibliographische Detailangaben
Hauptverfasser:	CHENG, Bo, TUFFILE, Charles
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A stencil printing system for printing solder paste on a base substrate to establish an electrical connection is provided. The system includes a stencil configured to removably attach or rest on an upper surface of the base. The stencil has an opening that provides access to the upper surface of the base. A squeegee spreads conductive paste across the stencil, whereupon the paste can be forced onto the upper surface of the base via the opening. In embodiments, the stencil has a stepped edge at the boundary of the opening. The stepped edge may include a platform or floor that sits lower than the upper surface of the stencil to collect the paste and reduce the amount of paste that falls back to the base as the stencil is removed. The squeegee may have a lower surface that extends oblique relative to the squeegee's leading surface and trailing surface.