LASER PROCESSING APPARATUS

LASER PROCESSING APPARATUS

A laser processing apparatus includes at least a laser oscillator, optical fiber (30), and laser head (40). Laser head (40) includes at least first and second shield glasses (45) and (47) and first and second light receivers (51) and (52) inside second housing (41). In first and second shield glasse...

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Hauptverfasser: NARUMI, KEIJI, OGUCHI, HISAYUKI
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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creator NARUMI, KEIJI
OGUCHI, HISAYUKI
description A laser processing apparatus includes at least a laser oscillator, optical fiber (30), and laser head (40). Laser head (40) includes at least first and second shield glasses (45) and (47) and first and second light receivers (51) and (52) inside second housing (41). In first and second shield glasses (45) and (47), first and second coating films (46) and (48) are respectively provided on light receiving surfaces of laser light (LB). First light receiver (51) receives laser light (LB) reflected by first coating film (46) and outputs a first light receiving signal, and second light receiver (52) receives laser light (LB) reflected by peripheral portion (48b) of second coating film (48) and outputs a second light receiving signal.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023060484A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023060484A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023060484A13</originalsourceid><addsrcrecordid>eNrjZJDycQx2DVIICPJ3dg0O9vRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRsYGZgYmFiaOhsbEqQIAwwUhVA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LASER PROCESSING APPARATUS</title><source>esp@cenet</source><creator>NARUMI, KEIJI ; OGUCHI, HISAYUKI</creator><creatorcontrib>NARUMI, KEIJI ; OGUCHI, HISAYUKI</creatorcontrib><description>A laser processing apparatus includes at least a laser oscillator, optical fiber (30), and laser head (40). Laser head (40) includes at least first and second shield glasses (45) and (47) and first and second light receivers (51) and (52) inside second housing (41). In first and second shield glasses (45) and (47), first and second coating films (46) and (48) are respectively provided on light receiving surfaces of laser light (LB). First light receiver (51) receives laser light (LB) reflected by first coating film (46) and outputs a first light receiving signal, and second light receiver (52) receives laser light (LB) reflected by peripheral portion (48b) of second coating film (48) and outputs a second light receiving signal.</description><language>eng</language><subject>CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230302&amp;DB=EPODOC&amp;CC=US&amp;NR=2023060484A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230302&amp;DB=EPODOC&amp;CC=US&amp;NR=2023060484A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NARUMI, KEIJI</creatorcontrib><creatorcontrib>OGUCHI, HISAYUKI</creatorcontrib><title>LASER PROCESSING APPARATUS</title><description>A laser processing apparatus includes at least a laser oscillator, optical fiber (30), and laser head (40). Laser head (40) includes at least first and second shield glasses (45) and (47) and first and second light receivers (51) and (52) inside second housing (41). In first and second shield glasses (45) and (47), first and second coating films (46) and (48) are respectively provided on light receiving surfaces of laser light (LB). First light receiver (51) receives laser light (LB) reflected by first coating film (46) and outputs a first light receiving signal, and second light receiver (52) receives laser light (LB) reflected by peripheral portion (48b) of second coating film (48) and outputs a second light receiving signal.</description><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJDycQx2DVIICPJ3dg0O9vRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AzKbq4hzh66qQX58anFBYnJqXmpJfGhwUYGRsYGZgYmFiaOhsbEqQIAwwUhVA</recordid><startdate>20230302</startdate><enddate>20230302</enddate><creator>NARUMI, KEIJI</creator><creator>OGUCHI, HISAYUKI</creator><scope>EVB</scope></search><sort><creationdate>20230302</creationdate><title>LASER PROCESSING APPARATUS</title><author>NARUMI, KEIJI ; OGUCHI, HISAYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023060484A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>NARUMI, KEIJI</creatorcontrib><creatorcontrib>OGUCHI, HISAYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NARUMI, KEIJI</au><au>OGUCHI, HISAYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER PROCESSING APPARATUS</title><date>2023-03-02</date><risdate>2023</risdate><abstract>A laser processing apparatus includes at least a laser oscillator, optical fiber (30), and laser head (40). Laser head (40) includes at least first and second shield glasses (45) and (47) and first and second light receivers (51) and (52) inside second housing (41). In first and second shield glasses (45) and (47), first and second coating films (46) and (48) are respectively provided on light receiving surfaces of laser light (LB). First light receiver (51) receives laser light (LB) reflected by first coating film (46) and outputs a first light receiving signal, and second light receiver (52) receives laser light (LB) reflected by peripheral portion (48b) of second coating film (48) and outputs a second light receiving signal.</abstract><oa>free_for_read</oa></addata></record>
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subjects CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title LASER PROCESSING APPARATUS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T00%3A44%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NARUMI,%20KEIJI&rft.date=2023-03-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023060484A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true