LASER PROCESSING APPARATUS

A laser processing apparatus includes at least a laser oscillator, optical fiber (30), and laser head (40). Laser head (40) includes at least first and second shield glasses (45) and (47) and first and second light receivers (51) and (52) inside second housing (41). In first and second shield glasse...

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Bibliographische Detailangaben
Hauptverfasser:	NARUMI, KEIJI, OGUCHI, HISAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A laser processing apparatus includes at least a laser oscillator, optical fiber (30), and laser head (40). Laser head (40) includes at least first and second shield glasses (45) and (47) and first and second light receivers (51) and (52) inside second housing (41). In first and second shield glasses (45) and (47), first and second coating films (46) and (48) are respectively provided on light receiving surfaces of laser light (LB). First light receiver (51) receives laser light (LB) reflected by first coating film (46) and outputs a first light receiving signal, and second light receiver (52) receives laser light (LB) reflected by peripheral portion (48b) of second coating film (48) and outputs a second light receiving signal.