RESIN COMPOSITION

The present invention is a resin composition, including: an addition polymerization resin α having a glass transition temperature of 150° C. or more; and a resin β having an aromatic dicarboxylic acid monomer unit A having a hydrophilic group and a dicarboxylic acid monomer unit B having no hydrophi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIMURA, Tadanori, ONOUE, Akihiro
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention is a resin composition, including: an addition polymerization resin α having a glass transition temperature of 150° C. or more; and a resin β having an aromatic dicarboxylic acid monomer unit A having a hydrophilic group and a dicarboxylic acid monomer unit B having no hydrophilic group. According to the present invention, a resin composition that can be easily removed with water while maintaining the heat resistance can be provided.