LEAD FRAME AND ELECTRONIC COMPONENT

A lead frame includes a die pad, a plurality of leads, a frame member, and at least one wire. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. Each of the specific leads is connected to the first connect...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAWAKI, Kazuma, MIYAZAKI, Shuhei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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