LEAD FRAME AND ELECTRONIC COMPONENT

A lead frame includes a die pad, a plurality of leads, a frame member, and at least one wire. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. Each of the specific leads is connected to the first connect...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YAMAWAKI, Kazuma, MIYAZAKI, Shuhei
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A lead frame includes a die pad, a plurality of leads, a frame member, and at least one wire. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. Each of the specific leads is connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one wire.