ADHESIVE COMPOSITIONS

ADHESIVE COMPOSITIONS

Embodiments of the present disclosure generally relate to adhesive compositions, and more particularly, to the use of polyolefin adhesive compositions for hot melt adhesive applications. In an embodiment, a composition includes a polymer, a resin, and an olefin wax. In an embodiment, an olefin wax m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Austin, Jennifer J, Hamilton, Adam P, Coffey, James N, White, Ronald G, Hamilton, Paul, Bekker, Madelyn
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:Embodiments of the present disclosure generally relate to adhesive compositions, and more particularly, to the use of polyolefin adhesive compositions for hot melt adhesive applications. In an embodiment, a composition includes a polymer, a resin, and an olefin wax. In an embodiment, an olefin wax may be a linear alpha olefin.