COMPOSITE BINDING AGENT GRINDING WHEEL AND PREPARATION METHOD THEREOF

COMPOSITE BINDING AGENT GRINDING WHEEL AND PREPARATION METHOD THEREOF

The present application relates to a composite binding agent grinding wheel, wherein a weight percentage of each raw material of the grinding wheel is: 45-65% of pretreatment abrasive, 8-20% of resin bonding agent, 5-12% of hexagonal boron nitride, 5-10% of silicon dioxide, 5-15% of ceramic powder,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Cao, Jianfeng, Wang, Lihua, Zhao, Yanjun, Zuo, Donghua, Zhang, Gaoliang, Sun, Guannan, Qian, Guanwen
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVES
CHEMISTRY
DYES
GRINDING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Beschreibung
Zusammenfassung:The present application relates to a composite binding agent grinding wheel, wherein a weight percentage of each raw material of the grinding wheel is: 45-65% of pretreatment abrasive, 8-20% of resin bonding agent, 5-12% of hexagonal boron nitride, 5-10% of silicon dioxide, 5-15% of ceramic powder, 6-12% of prealloy powder bonding agent, and 1-3% of boron powder. The composite binding agent super-hard grinding wheel prepared by the present application can achieve nano-level grinding surface quality when grinding epitaxial wafers, and the grinding wheel has strong self-sharpening and high sharpness. It has obvious advantages in the finishing of silicon carbide crystal epitaxial wafers, which can solve the current limitations of back thinning processing of silicon carbide crystal epitaxial wafers.