Semiconductor Device Module Comprising Flexible Leads for the Purpose of Height Adjustment

A semiconductor device module includes an application board, a plurality of semiconductor device packages disposed on the application board, each one of the semiconductor device packages including a semiconductor die, a leadframe including a plurality of leads, the leads including a spring support and a heat dissipation element, and an encapsulant embedding the semiconductor die and first portions of the leads, an external heatsink, and one or more thermally conductive interface layers disposed between the semiconductor device package and the heatsink.