heat dissipation and electrical robustness in a three-dimensional package of stacked integrated circuits

An electronic device, including a substrate and a stack of dies stacked on the substrate. The stack of dies includes: (a) one or more functional dies, the functional dies including functional electronic circuits and being configured to exchange electrical signals at least with the substrate, and (b) one or more dummy dies, the dummy dies being disposed among dies forming the stack and being configured to: (i) dissipate heat generated by the one or more functional dies and (ii) pass electrical signals exchanged between the substrate and the one or more functional dies or between two or more of the functional dies.