SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES

SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES

A semiconductor package includes; a first semiconductor chip and a second semiconductor chip connected by bump structures, wherein the bump structures include first bump structures having a first shape and second bump structures having a second shape different from the first shape, and each of the b...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YEON, SEUNGHOON, KIM, SUNJAE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package includes; a first semiconductor chip and a second semiconductor chip connected by bump structures, wherein the bump structures include first bump structures having a first shape and second bump structures having a second shape different from the first shape, and each of the bump structures includes a first pillar layer associated with the first semiconductor chip and a second pillar layer associated with the second semiconductor chip.