MATING AND DEMATING OF SURFACES OF TWO STRUCTURES
A method for mating a first surface of a first structure to a second surface of a second structure, the method comprising: providing a device at least comprising: a first body adapted for insertion at least in a through hole of the first surface; and a second body adapted for insertion at least in a...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A method for mating a first surface of a first structure to a second surface of a second structure, the method comprising: providing a device at least comprising: a first body adapted for insertion at least in a through hole of the first surface; and a second body adapted for insertion at least in a through hole of the second surface, the first body being further adapted for being mechanically coupled with a second body, and the second body being mechanically coupled with the first body; inserting at least a first portion of the first body in the through hole of the first surface; inserting the second body in the through hole of the second surface when the first and second surfaces are spaced apart by a distance; providing an apparatus for winding the second body; arranging the second body on the apparatus; and pulling one of the first and second structures towards the other one of the first and second structures by winding the second body with the apparatus. |
---|