MATING AND DEMATING OF SURFACES OF TWO STRUCTURES

A method for mating a first surface of a first structure to a second surface of a second structure, the method comprising: providing a device at least comprising: a first body adapted for insertion at least in a through hole of the first surface; and a second body adapted for insertion at least in a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAVA, Vincenzo, VILLATE MARTÍNEZ, José Luis, Rubio, Antonio Rico, BERQUE, Joannes, SELLNER, Jan
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A method for mating a first surface of a first structure to a second surface of a second structure, the method comprising: providing a device at least comprising: a first body adapted for insertion at least in a through hole of the first surface; and a second body adapted for insertion at least in a through hole of the second surface, the first body being further adapted for being mechanically coupled with a second body, and the second body being mechanically coupled with the first body; inserting at least a first portion of the first body in the through hole of the first surface; inserting the second body in the through hole of the second surface when the first and second surfaces are spaced apart by a distance; providing an apparatus for winding the second body; arranging the second body on the apparatus; and pulling one of the first and second structures towards the other one of the first and second structures by winding the second body with the apparatus.