THERMAL MANAGEMENT SYSTEMS HAVING PRESTRESSED BIASING ELEMENTS AND RELATED METHODS

THERMAL MANAGEMENT SYSTEMS HAVING PRESTRESSED BIASING ELEMENTS AND RELATED METHODS

Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive stru...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: McEuen, Shawn, Stevens, Kerry A, Peterson, Jerrod, Paavola, Juha, Huttula, Justin M
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive structure is to dissipate heat generated by the processor. The electronic component includes a pre-stressed biasing element coupled to the thermally conductive structure and positioned between the processor and the thermally conductive structure. The pre-stressed biasing element is pre-stressed prior to attachment to the thermally conductive structure and the circuit board.