HIGH DENSITY BEZEL FOR PATCH PANEL

HIGH DENSITY BEZEL FOR PATCH PANEL

A telecommunications patch panel system (10) including a plurality of multiport telecommunications bezel assemblies (200) installed within a panel frame (100) is presented. The bezel assemblies (200) are formed from cooperating first and second frame parts (210, 240) to define a plurality of jack re...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WHITE, Gordon John, FITZPATRICK, Brian J, TOBEY, Shawn Phillip
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LINE CONNECTORS
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Beschreibung
Zusammenfassung:A telecommunications patch panel system (10) including a plurality of multiport telecommunications bezel assemblies (200) installed within a panel frame (100) is presented. The bezel assemblies (200) are formed from cooperating first and second frame parts (210, 240) to define a plurality of jack receptacle openings (202). In one example, the plurality of jack receptacles (202) are arranged in a two-row array. The first and second frame parts (210, 240) also retain a central bonding strip (290) having a plurality of grounding contact elements (292, 293). The grounding contact elements (292, 293) ground the jack modules (120) that are installed within the bezel assembly jack receptacle openings (202). Where a two-row array of jack receptacle openings (202) is provided, the central bonding strip (290) can be configured to extend between the rows. The central bonding strip (290) can provide grounding for multiple bezel assemblies (200).