Polyolefin resin composition having high rigidity and low coefficient of linear thermal expansion and weight-reduced automobile part comprising same

Polyolefin resin composition having high rigidity and low coefficient of linear thermal expansion and weight-reduced automobile part comprising same

The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene-based resin having an isotactic pentad fraction...

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Bibliographische Detailangaben
Hauptverfasser: Park, Chun Ho, Yoon, Jin Young, Lee, Hee Joon, Cha, Dong Eun, Jeong, Seung Ryong, Ko, Jeong Gil, Kwon, Sun Jun, Lee, Yoon Hwan
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene-based resin having an isotactic pentad fraction of 96% or more as measured by 13C-NMR, a thermoplastic elastomer, an inorganic filler having an average particle diameter of 0.1 μm to 5 μm, and a compatibilizer, and has a flexural modulus of 2,500 MPa or more and a coefficient of linear thermal expansion of 60 μm/m·° C. or less.