METHODS AND APPARATUS TO IMPROVE PIN CONTACT OF A COMPONENT STACK

Methods, apparatus, systems, and articles of manufacture to improve pin contact are disclosed. An apparatus disclosed herein includes a back plate, a circuit board disposed between the back plate and a socket, and a spring sheet disposed between the back plate and the circuit board.

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Bibliographische Detailangaben
Hauptverfasser:	Miele, Ralph, Johnson, Jordan, Geng, Phil, Pei, Min, Liu, Mengqi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Methods, apparatus, systems, and articles of manufacture to improve pin contact are disclosed. An apparatus disclosed herein includes a back plate, a circuit board disposed between the back plate and a socket, and a spring sheet disposed between the back plate and the circuit board.