METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER AND INTEGRATED CIRCUIT INCLUDING THE REDISTRIBUTION LAYER

A method of manufacturing a redistribution layer includes: forming an insulating layer on a wafer, delimited by a top surface and a bottom surface in contact with the wafer; forming a conductive body above the top surface of the insulating layer; forming a first coating region extending around and a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CUPETA, Carmela, VENEGONI, Ivan, PIPIA, Francesco Maria, COLPANI, Paolo, BOSSI, Simone, SCIARRILLO, Samuele
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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