SEMICONDUCTOR PACKAGE STRUCTURE

A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a first electronic component, a second electronic component, a third electronic component, a fourth electronic component, and a connection element. The first electronic component is disposed over a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, Chien-Chi, HSIA, Jyan-Ann
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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