SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a first electronic component, a second electronic component, a third electronic component, a fourth electronic component, and a connection element. The first electronic component is disposed over a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE, Chien-Chi, HSIA, Jyan-Ann
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor package structure is provided. The semiconductor package structure includes a carrier, a first electronic component, a second electronic component, a third electronic component, a fourth electronic component, and a connection element. The first electronic component is disposed over a surface of the carrier. The second electronic component is disposed over the first electronic component. The third electronic component is spaced apart from the first electronic component and disposed over the surface of the carrier. The fourth electronic component is disposed over the third electronic component. The connection element is electrically connecting the second electronic component to the fourth electronic component.