SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Disclosed are semiconductor packages and their fabricating methods. A semiconductor package includes a semiconductor chip on a redistribution substrate. The redistribution substrate includes a base dielectric layer and upper coupling pads in the base dielectric layer. Top surfaces of the upper coupling pads are coplanar with a top surface of the base dielectric layer. The semiconductor chip includes a redistribution dielectric layer and redistribution chip pads in the redistribution dielectric layer. Top surfaces of the redistribution chip pads are coplanar with a top surface of the redistribution dielectric layer. The top surface of the redistribution dielectric layer is bonded to the top surface of the base dielectric layer. The redistribution chip pads are bonded to the upper coupling pads. The redistribution chip pads and the upper coupling pads include a same metallic material. The redistribution dielectric layer and the base dielectric layer include a photosensitive polymer layer.