CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTERFACE

CHIP PACKAGE WITH SUBSTRATE INTEGRATED WAVEGUIDE AND WAVEGUIDE INTERFACE

A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SI...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HARTNER, Walter, RIEDER, Bernhard, MOELLER, Ulrich, SELER, Ernst, ERDOEL, Tuncay, WOJNOWSKI, Maciej
Format: Patent
Sprache:eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
SEMICONDUCTOR DEVICES
WAVEGUIDES
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Beschreibung
Zusammenfassung:A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.