POWER MODULE AND POWER CONVERSION DEVICE

A power module includes an insulating substrate, a case member, a power semiconductor element, a base member, a sealing member, and an adhesive member. The insulating substrate has a first surface and a second surface opposite to the first surface. The case member surrounds the insulating substrate...

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Bibliographische Detailangaben
Hauptverfasser:	HARADA, Kozo, SAKAMOTO, Ken, YAMAGUCHI, Yoshihiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A power module includes an insulating substrate, a case member, a power semiconductor element, a base member, a sealing member, and an adhesive member. The insulating substrate has a first surface and a second surface opposite to the first surface. The case member surrounds the insulating substrate when viewed in a direction perpendicular to the first surface. The power semiconductor element faces the first surface. The base member faces the second surface. The sealing member seals the power semiconductor element and the insulating substrate and is in contact with the case member. The adhesive member fixes the base member and the case member, and surrounds the insulating substrate when viewed in the direction perpendicular to the first surface.