BONDING SYSTEM AND INSPECTION METHOD OF INSPECTING COMBINED SUBSTRATE

A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. Th...

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Bibliographische Detailangaben
Hauptverfasser:	Manabe, Eiji, Maeda, Hiroshi, Hizume, Hisanori, Otsuka, Yoshitaka, Mimura, Yuji, Tsuruta, Shigeto, Shinozuka, Shinichi, Tanoue, Hironori
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A bonding system includes a bonding device, an inspection device and a controller. The bonding device forms a combined substrate by bonding a first substrate and a second substrate to each other. The inspection device inspects the combined substrate. The controller controls the inspection device. The controller includes a measurement controller, a comparison unit and a re-measurement controller. The measurement controller causes the inspection device to measure the combined substrate at a first number of measurement points. The comparison unit compares, with a reference, an inspection result including a deviation amount between the first substrate and the second substrate in the combined substrate based on a measurement result. The re-measurement controller causes the inspection device to re-measure the combined substrate at a second number of measurement points greater than the first number of measurement points based on a comparison result obtained by the comparison unit.