CONDUCTIVE PASTE AND CONDUCTIVE FILM FORMED USING THE SAME

A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.

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Bibliographische Detailangaben
Hauptverfasser: OHASHI, NAOMICHI, MATSUNO, KOSO
Format: Patent
Sprache:eng
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Zusammenfassung:A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.