SUBSTRATE SUPPORT MECHANISM, SUBSTRATE CLEANING DEVICE AND SUBSTRATE PROCESSING METHOD

The disclosure provides one technique for suppressing wear of a cleaning member and unexpected dust generation. A substrate support mechanism 100 includes a first support part 110 which is swingable and has a contact region that can come into contact with a peripheral edge of one surface of a substr...

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Bibliographische Detailangaben
Hauptverfasser: NAKANO, HISAJIRO, MIYAZAKI, MITSURU, INOUE, Takuya
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The disclosure provides one technique for suppressing wear of a cleaning member and unexpected dust generation. A substrate support mechanism 100 includes a first support part 110 which is swingable and has a contact region that can come into contact with a peripheral edge of one surface of a substrate W in a closed state, a second support part 120 which supports the other surface of the substrate W, and a first support part moving part 140 which swings the first support part 110.