COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK

Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mou...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lewis, Theron Lee, Dangler, John R, Braun, David J
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.