SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLE

A substrate processing device according to an embodiment of the present invention includes a disk part disposed in a chamber in which a heating means is provided, and a pocket part installed on one surface of the disk part and on which a substrate is seated. A heat hole through which heat generated...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SEO, Dong Won, KONG, Han Young, LEE, Baek Ju, KIM, Su Woong, KIM, Sang Bo, CHOI, Jae Wook, MOON, Sang Yoon, HWANG, Jae Soon, CHOI, Seung Dae
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A substrate processing device according to an embodiment of the present invention includes a disk part disposed in a chamber in which a heating means is provided, and a pocket part installed on one surface of the disk part and on which a substrate is seated. A heat hole through which heat generated by the heating means passes may be formed on an installation surface of the disk part on which the pocket part is installed, or a gear hole through which the heat of the heating means passes may be formed in a pocket gear facing the disk part.