COMPOSITION, PASTE AND METHODS
Disclosed is a composition for sealing inorganic substrates. The composition includes a glass frit and optionally a filler material, wherein the glass frit contains: 30 to 65 wt % V2O5; 5 to 35 wt % P2O5; 0 to 30 wt % TeO2; 0 to 30 wt % Bi2O3; 0 to 15 wt % ZnO; 0 to 10 wt % MnO; 0 to 5 wt % B2O3; 0...
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Sprache: | eng |
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Zusammenfassung: | Disclosed is a composition for sealing inorganic substrates. The composition includes a glass frit and optionally a filler material, wherein the glass frit contains: 30 to 65 wt % V2O5; 5 to 35 wt % P2O5; 0 to 30 wt % TeO2; 0 to 30 wt % Bi2O3; 0 to 15 wt % ZnO; 0 to 10 wt % MnO; 0 to 5 wt % B2O3; 0 to 5 wt % total alkali metal oxides; 0 to 2 wt % Nb2O5; 0 to 2 wt % WO3; 0 to 2 wt % MoO3; 0 to 2 wt % SiO2; and 0 to 2 wt % Al2O3. |
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