POLISHING PADS WITH INTERCONNECTED PORES

Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post inclu...

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Hauptverfasser: WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath, FUNG, Jason Garcheung, KAKIREDDY, Veera Raghava Reddy, JAWALI, Puneet Narendra, CHOCKALINGAM, Ashwin, BARADANAHALLI KENCHAPPA, Nandan, BAJAJ, Rajeev
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creator WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath
FUNG, Jason Garcheung
KAKIREDDY, Veera Raghava Reddy
JAWALI, Puneet Narendra
CHOCKALINGAM, Ashwin
BARADANAHALLI KENCHAPPA, Nandan
BAJAJ, Rajeev
description Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.
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subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title POLISHING PADS WITH INTERCONNECTED PORES
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