POLISHING PADS WITH INTERCONNECTED PORES

Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post inclu...

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Bibliographische Detailangaben
Hauptverfasser:	WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka Jayanath, FUNG, Jason Garcheung, KAKIREDDY, Veera Raghava Reddy, JAWALI, Puneet Narendra, CHOCKALINGAM, Ashwin, BARADANAHALLI KENCHAPPA, Nandan, BAJAJ, Rajeev
Format:	Patent
Sprache:	eng
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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Beschreibung
Zusammenfassung:	Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A polishing pad includes a plurality of polishing elements and a plurality of grooves disposed between the polishing elements. Each polishing element includes a plurality of individual posts. Each post includes an individual surface that forms a portion of a polishing surface of the polishing pad and one or more sidewalls extending downwardly from the individual surface. The sidewalls of the plurality of individual posts define a plurality of pores disposed between the posts.