LIGHT-EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREOF

LIGHT-EMITTING DIODE CHIP AND MANUFACTURING METHOD THEREOF

The present disclosure provides a light-emitting diode chip, which includes a substrate, an epitaxial structure, an electrode metal layer, and a eutectic metal layer. The eutectic metal layer has an elongation greater than that of the electrode metal layer, and a hardness less than that of the elect...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Peng, Kangwei, Lin, Suhui, Wang, Qing, Zhan, Yu, He, Anhe, Hong, Lingyuan, Liu, Peng, Zeng, Jiangbin, Chang, Chung-ying, Lu, Chao
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present disclosure provides a light-emitting diode chip, which includes a substrate, an epitaxial structure, an electrode metal layer, and a eutectic metal layer. The eutectic metal layer has an elongation greater than that of the electrode metal layer, and a hardness less than that of the electrode metal layer.