MEASUREMENT JIG AND PROCESSING METHOD

A measurement jig for measuring the conditions in a device and a processing method are provided. A measurement jig having a substrate, a back-surface camera provided on a back-surface side of the substrate, and a controller configured to control the back-surface camera.

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Bibliographische Detailangaben
Hauptverfasser:	ENOMOTO, Tadashi, YAMAMOTO, Masakazu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A measurement jig for measuring the conditions in a device and a processing method are provided. A measurement jig having a substrate, a back-surface camera provided on a back-surface side of the substrate, and a controller configured to control the back-surface camera.