Oblique Deposition and Etch Processes

A method of processing a substrate that includes receiving a patterned photoresist formed over a substrate, the patterned photoresist defining initial openings, each of the initial openings including a first side and an opposite second side along a first direction; depositing a mask material preferentially on the first side within the initial openings using an oblique deposition process performed at a first angle inclined from the first side; and removing a portion of the patterned photoresist using an oblique etch process performed at a second angle inclined from the second side, the mask material and a remaining portion of the patterned photoresist defining final openings.